Global Embedded Die Packaging Market by Product Type (Embedded Die in Rigid Board, Embedded Die in Flexible Board, and Embedded Die in IC Package Substrate), By End Use (Consumer Electronics, IT & Telecommunications, Automotive, and Healthcare), and by Region – Global Forecast to 2032

Embedded Die Packaging Market Overview:

The global embedded die packaging market is projected to be USD 27.30 Mn in 2022 to reach USD 77.05 Mn by 2032 at a CAGR of 11.2%.

An embedded die is defined as a passive component or integrated circuit placed on the inner layer of an organic circuit board, module, or chip package. Embedded die packaging involves embedding components inside a substrate through a multi-step manufacturing process.

One die, multiple dies, MEMS, or passive devices can be embedded side by side in the core of an organic laminate substrate using copper connection components.

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Embedded die packaging is different from most package types. Generally, in many IC packages, the device is located on top of the substrate. The substrate acts as a bridge between the device and the board in the system.

Benefits of embedding active chips or dies include miniaturization, improved electrical and thermal performance, heterogeneous integration, opportunities to reduce costs, and simplified logistics for OEMs.

Embedded chips are available in several IC packaging types such as lead frames, wafer-level packaging (WLP), and substrate. Substrate-based packages are divided into several categories, such as ceramic and organic laminates.

The ceramic substrate is based on alumina, aluminum nitride, and other materials. Ceramic-based packages are used for CMOS image sensors, multi-chip modules, and surface mount devices. Organic substrates are also multilayer technologies, where a metal layer separates at least two organic layers.

Global Embedded Die Packaging Market Revenue (USD Mn), 2020–2030:

Increasing demand for consumer electronics such as smartphones, set-top boxes, displays, electronic household appliances, and the surge in applications such as the Internet of Things and cloud computing are the key factors expected to drive revenue growth of the global embedded die packaging market.

Increasing demand for embedded die to integrate more chips and functions owing to functions such as higher performance, lower power consumption, and better heat dissipation into a smaller form factor. This factor is expected to propel the financial growth of the target market.

Embedded die packaging is a complicated process that requires advanced equipment and high cost. Manufacturing of semiconductor wafers involves silicon purification, which is a complicated process that will eventually increase costs.

The cost of technological advancement is huge, requiring a large investment to develop R&D capabilities for semiconductor assembly and testing services. This factor is expected to restrain market growth to a certain extent.

Global Embedded Die Packaging Market Attractiveness Analysis by Product Type, 2014–2030:

The global embedded die packaging market is segmented into product type, end-user, and region. It is further segregated into embedded die in a rigid board, embedded die on a flexible board, and embedded die in the IC package substrate based on product type segment.

Embedded die in the flexible board segment accounts for the highest revenue share among the product type segment, owing to its adoption of embedded die in manufacturing consumer electronics devices and MEMS applications.

Based on end-user, consumer electronics holds a significant share in terms of revenue. This is primarily attributed to the increased demand for entertainment, electronic appliances, and communication products used on a large scale.

Based on the region, the North American market is estimated to account for the most revenue than other regions. It is projected to dominate the global embedded die packaging market in the coming years.

The research report on the global embedded die packaging market includes profiles of some of the major companies such as:

• General Electric
• Toshiba Corporation
• Taiwan Semiconductor Manufacturing Company
• ASE Group
• Fujikura Ltd.
• Microchip Technology, Inc.
• Amkor Technology
• AT & S Austria Technologie & Systemtechnik AG
• Würth Elektronik GmbH & Co. KG
• Schweizer Electronic AG
• Others.

Global Embedded Die Packaging Market is segmented based on Platform, End-Use, and Region:

Based on Platform

• Embedded Die in Rigid Board
• Embedded Die in Flexible Board
• Embedded Die in IC Package Substrate

Based on End-Use

• Consumer Electronics
• IT and Telecommunications
• Automotive
• Healthcare

Based on Region

• North America
• Europe
• Asia-Pacific
• South America
• Middle East & Africa

For the Embedded Die Packaging Market research study, the following years have been considered to estimate the market size: