Global Semiconductor Wafer Transfer Robots Market Size, Share, Industry Analysis Report By Axis Configuration (2-Axis Robots, 3-Axis Robots, 4-Axis Robots, 5-Axis Robots, 6-Axis Robots, SCARA Robots, Cartesian Robots), By Wafer Size (≤100 mm, 150 mm, 200 mm, 300 mm, >300 mm), By Application (Wafer Handling in Front-End Process, Back-End Packaging & Assembly, Metrology & Inspection, Cleaning & Etching, Lithography, Ion Implantation, Deposition (PVD, CVD, ALD), CMP (Chemical Mechanical Planarization)), By Cleanroom Compatibility (ISO Class 1, ISO Class 2, ISO Class 3, ISO Class 4 and above), By Level of Automation (Standalone Robotic Arms, Integrated Robotic Systems, AMR (Autonomous Mobile Robots) with Wafer Transfer Modules), By Motion Type (Linear Motion Robots, Rotary Motion Robots, Hybrid Motion Robots), By End User (IDM (Integrated Device Manufacturers), Foundries, OSAT (Outsourced Semiconductor Assembly and Test), Research & Academic Institutions, Equipment OEMs), By Regional Analysis, Global Trends and Opportunity, Future Outlook by 2025-2034
- Published date: Sept. 2025
- Report ID: 159879
- Number of Pages: 306
- Format:
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- KUKA AG
- Hirata Corporation
- JEL Corporation
- Yamaha Robotics
- Shibaura Machine (formerly Toshiba Machine)
- Kensington Laboratories
- Siasun Robot & Automation Co.
- TAEHA Mechatronics
- HIWIN Technologies Corp.
- Nidec Sankyo Corporation
- Brooks Automation
- Yaskawa Electric Corporation
- Rorze Corporation
- Kawasaki Robotics
- Robostar Co., Ltd.
- DAIHEN Corporation
- RAONTEC Inc.
- AUTOMATECH Robotics
- HIRATA FA Engineering
- Tazmo Co., Ltd.
- Others
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