Global 3d Sensing and Imaging Market By Component (Hardware, Software, Services), By Technology (Ultrasound, Structured Light, Time-of-Flight, Stereoscopic Vision, Other Technologies), By Sensor Type (Position Sensors, Image Sensors, Temperature Sensors, Accelerometer Sensors, Proximity Sensors, Other Sensor Types), By Connectivity (Wired Network Connectivity, Wireless Network Connectivity), By End-user Industry (Consumer Electronics, Automotive, Healthcare, Aerospace and Defense, Security and Surveillance, Media and Entertainment, Others), By Regional Analysis, Global Trends and Opportunity, Future Outlook By 2025-2034
- Published date: Nov. 2025
- Report ID: 166548
- Number of Pages: 260
- Format:
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- STMicroelectronics N.V.
- Infineon Technologies AG
- Microchip Technology Inc. Company Profile
- Viavi Solutions Inc.
- Rockwell Automation Inc.
- KEYENCE Corporation
- Suteng Innovation Technology Co. Ltd.
- Autodesk Inc.
- Cognex Corporation
- OMNIVISION Technologies Inc.
- SICK AG
- Panasonic Holdings Corporation
- Sony Group Corporation
- Lumentum Holdings Inc.
- FARO Technologies Inc.
- Occipital Inc.
- LMI Technologies Inc.
- Trimble Inc.
- Balluff GmbH
- Others
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