Global High-End Copper Foil Market Size, Share, And Enhanced Productivity By Type (Electrode Foll, Circuit Board Foll, Winding Foil, Heat Sink Foll), By Thickness (Below 18 Micron, 18-35 Micron, 35-50 Micron, Above 50 Micran), By Application (Consumer Electronics, Automotive, Aerospace, Telecommunications, Others), By Region and Companies - Industry Segment Outlook, Market Assessment, Competition Scenario, Trends, and Forecast 2025-2034