Us And European Electrodeposited Copper Foil Market By Application (Flexible Printed Circuit Board, Rigid Printed Circuit Board, Other Pcb, Lib For Ev/Phv, Lib For Consumer Electronics, Lib For Others),

Market.us announces publication of its most recently generated research report titled, “US and European Electrodeposited Copper Foil Market by Application (Flexible Printed Circuit Board, Rigid Printed Circuit Board, Other PCB, LIB for EV/PHV, LIB for Consumer Electronics, LIB for Others), and by Region – Global Forecast to 2028.”, which offers a holistic view of the US and European electrodeposited copper foil market through systematic segmentation that covers every aspect of the target market.

The US and European electrodeposited copper foil market is projected to be US$ 962.3 Mn in 2018 to reach US$ 1,567.2 Mn by 2028 at a CAGR of 5.0%.

Among non-ferrous metals, copper is the most widely used material along with aluminum, since it is highly versatile. Thin copper foils are produced either by electrodeposition or rolling process. The copper foils made by electrodeposition are called as electrodeposited copper foil. The process used for electrodeposition is also known as plating. In this process, a copper electrolyte solution is pumped into electrically charged rotating drums to electrodeposit a thin film of copper.  A typical electrodeposited copper foil has a vertical gain structure beneficial for obtaining tight-etched spacing and well-defined conductor walls. Therefore, they are advantageous to support the increasing trend towards smaller size and higher performance of electronic equipment.

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Government initiatives- Favorable government initiatives towards green energy, owing to depleting fossil fuel resources and to correct the ecological system due to increasing carbon emissions, has brought focus of several countries governments to mandate regulations for electric vehicles, which is another factor augmenting growth of the electrodeposited copper foil market in the US and European region.

US and European Electrodeposited Copper Foil Market Revenue (US$ Mn), 2018–2028

However, development of nanomaterials as a viable substitute for copper foils is expected to pose a major threat to electrodeposited copper foil market, thereby hampering growth of the market to a certain extent. Nonetheless, emerging application of electrodeposited copper foils in grid-level energy storage systems and transformers and their increasing use owing to growing demand for power, is expected to provide lucrative opportunities for several players in the market, thereby further fueling growth of the US and European electrodeposited copper foil market.

US and European electrodeposited copper foil market is segmented on the basis application and region. On the basis of application, the market is segmented into shower flexible printed circuit board, rigid printed circuit board, other PCB, LIB for EV/PHV, LIB for consumer electronics, LIB for others. Flexible printed circuit board segment accounts for a majority share in the US and European electrodeposited copper foil market and is expected register highest growth over the forecast period, followed by LIB for EV/PHV.

US and European Electrodeposited Copper Foil Market by Formulation, 2018

On the basis of region, the market is segmented into US and Europe. The Europe accounts for the majority share in the US and European electrodeposited copper foil market. US is expected to register highest growth rate after over forecast period owing to robust growth of electric and hybrid vehicles market.

The research report on the US and European Electrodeposited Copper Foil market includes profiles of some of major companies such as Mitsui Mining & Smelting Co., Ltd., Furukawa Electric Co., Ltd., Doosan Corporation, Global Brass and Copper Holdings, Inc., JXTG Holdings, Inc, LS Corp, ILJIN Materials Co., Ltd.

Key Market Segments

Application

• Flexible Printed Circuit Board
• Rigid Printed Circuit Board
• Other PCB
• LIB for EV/PHV
• LIB for Consumer Electronics
• LIB for Other

Key Market Players included in the report:

• Mitsui Mining & Smelting Co. Ltd.
• Furukawa Electric Co. Ltd.
• Doosan Corporation
• Global Brass and Copper Holdings Inc.
• JXTG Holdings Inc
• LS Corp
• ILJIN Materials Co. Ltd